Q&A with 3rd edition Editor, Krishna Seshan

How is this handbook different from the other titles already available?
First this is not a pedagogical text dealing with the fundamentals of thin film deposition. Such material is much better covered by more specialized books. Rather this is a Handbook written by practicing engineers and process designers - those who are developing integrated thin film processes. My handbook provides information about process integration and an understanding of how thin films work together to provide high yield reliable semiconductor products. So the chapters are more about the process of developing architectures of various thin films that work together in an integrated device environment.

What are we looking for by way of new chapters and contributors?
We are looking for potential practicing engineers who would like to write about their specialties.
We would like to see chapters dealing with the evolution of lithography and its role in thin film choices. We would like to see a chapter on multilayer high K dielectric gates for gate technology. We would like to see chapters dealing with new materials like Chalgogenides which are being considered for flash and memory applications.

How can prospective authors contact you?
Other than posting to this blog, I would invite new authors to contact me direct:
Krishna Seshan (krishna.seshan@gmail com), Editor of Handbook of Thin Film Deposition, 3rd edition

Intro to the Handbook of Thin Film Deposition - by Krishna Seshan

The Handbook of Thin Film Deposition 1st Ed was edited by W. Schuegraf and W. Kerns and was published by Noyes Publications in 1980s. It had classic material like a chapter on Wafer Cleaning by Werner Kerns, an extensive chapter on Silicon Epi by Martin Hammond etc. These chapters were written by the early developers of these techniques that have now become standard practice in the Industry.

The 2nd Edition was published in 2002, and took into account significant developments in the thin film architecture of silicon devices. Chapters on the practicality of wafer processing, maintaining high yeilds, and contamination control were added. However the book did not have a chapter on Cu interconnect.

The 3rd edition will have new chapters that include a description of the the low K dielectric and Cu interconnect metallurgy and the various thin film manufacturing steps needed for it s manufacture. This will include a chapter on chemical mechanical polishing. Coverage of various reliability issues in Cu interconnect metallurgy is planned.

In addition there has been a spawning of new and related devices: solar thin films, many thin film applications leading to the inclusion of radio frequency devices to enable wireless in handheld devices, and developments that wil lead to the inclusion of lasers and light as part of the device function. So a new section called Emerging Technologies will be added.

Lastly we are fortunate to be able to include a chapter on Optical Thin Films by Angus McCloud of the Thin Film Center, in anticipation of the integration of optics and optical components into semiconductors.